PLAB's recent revenue decline and margin contraction stem from delayed IC design releases, memory supply constraints, and ...
HSINCHU, April 23, 2026 /PRNewswire/ -- M31 Technology (M31), a global silicon intellectual property (IP) provider, today announced at the TSMC 2026 North America Technology Symposium that its eUSB2V2 ...
LAWRENCEVILLE, Ga.--(BUSINESS WIRE)--Silicon Creations, a leading provider of precision IP for advanced SoC design, today announced its 1000th production FinFET tapeout at TSMC, alongside the ...
At Xiaomi's 2025 annual conference, founder Lei Jun spoke with calm restraint about the company's self-developed Xring O1 chip. Yet beneath that composure were moments of risk and suspense: the US$20 ...
IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely with the ...
TSMC announced three new advanced process technologies at its North America Technology Symposium last week A13, A12 and N2U as part of its latest advanced technology roadmap. Compared to the roadmap ...
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TSMC’s 2nm chip capacity through 2026 is already sold out as every wafer goes to AI data center customers
TSMC has no 2nm wafers left to sell. Every chip the company can manufacture on its most advanced process through the end of 2026 has already been claimed by customers building silicon for artificial ...
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